Online Course – Certified Professional Internship in Semiconductor Packaging from Google and Arizona State University

Semiconductor Sourcing and Marketing: Design and Manufacturing. Acquire the skills and knowledge required to design, manufacture, and protect semiconductors with this comprehensive specialization, developed in collaboration with ASU and Intel.

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קורס אונליין - התמחות מקצועית מוסמכת באריזת מוליכים למחצה של גוגל ואוניברסיטת אריזונה סטייט

Professional Certificate

Beginners

No prior knowledge required

Time to complete the course

7-day free trial

No unnecessary risks

Skills you will acquire in the course

  • Quality control in semiconductor packaging
  • Material selection and tests
  • Applications of semiconductors
  • Manufacturing techniques in semiconductor packaging
  • Future Trends and Innovations in Semiconductor Packaging
  • Semiconductor packaging design

What you will learn in the course

Courses for which the course is suitable

  • Microelectronics Engineer
  • Semiconductor Packaging Engineer
  • Product developer in the electronics field
  • Quality Engineer in the Semiconductor Field
  • Microelectronics Project Manager
  • Production technician in electronics factories
  • Semiconductor Packaging Technologies Expert
  • Microelectronics researcher
  • Electronic Systems Engineer
  • Director of New Technology Development in the Semiconductor Field

specialization

  • 3-part course series
  • Microelectronics affects all aspects of our daily lives:
    • Consumer products
    • vehicle
    • communication
    • Computers
    • medicine
    • agriculture
  • All systems must be stored in safe packaging.

Collaboration

  • The internship was created in collaboration between ASU and Intel.

Course content

  • Provides a basic understanding of:
    • What is Semiconductor Packaging?
    • How packaging is designed and manufactured
    • How they work to terminate, connect, and protect functional components

Hands-on Learning Project

  • Learners will conduct assessments based on practical experiences from industry.
  • These assessments will serve as a basis for learners to effectively demonstrate the application of semiconductor packaging methodology.

Course structure

  • The step-by-step workflow is designed to ensure success for learners.

Details of the courses that make up the specialization

Introduction to semiconductor packaging

Course 1

  • 10 hours
  • 4.6 (90 ratings)

Course Details

What you’ll learn
  • Introduction to basic concepts such as length dimensions, transistor operations, and feature sizes in integrated circuits.
  • Historical viewing and trends using Moore’s Law.
  • An investigation of the anatomy and function of semiconductor packaging.
  • Understanding different types of packaging and how they differ in material, design, and reliability.
Skills you will develop
  • Category: Material Modeling and Device Classification
  • Category: Thermal Management
  • Category: Semiconductor Packaging Design
  • Category: Length dimensions in material and classification of devices

Semiconductor packaging manufacturing

Course 2

  • 8 hours
  • 4.6 (40 ratings)

Course Details

What you’ll learn
  • Learn about the different stages in the production of semiconductor packaging.
  • The role of process control systems in semiconductor manufacturing.
  • How process control systems can help identify and correct process problems.
  • How to use controller graphs to monitor process performance.
Skills you will develop
  • Category: Process Improvement
  • Category: Integrated Circuit Packaging Materials
  • Category: Semiconductor Packaging Assembly Process
  • Category: Quality and Reliability Assessment
  • Category: Assembly methods

Advanced semiconductor packaging

Course 3

  • 6 hours
  • 4.7 (55 ratings)

Course Details

What you’ll learn
  • Introduction to assembly and packaging technology tracks.
  • The evolution and impact of packaging on product performance and innovation.
Skills you will develop
  • Category: Future Packaging Technologies
  • Category: Advanced Assembly Methods
  • Category: Heterogeneous Integration
  • Category: 2.5D and 3D integration methods

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